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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
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Testing SystemPower Testing System
WAT Testing System
IC Testing System
RF Testing System
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Enterprise Profile
Enterprise News
Recruitment Information
Contact Us
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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
-
Testing SystemPower Testing System
WAT Testing System
IC Testing System
RF Testing System
-
Enterprise Profile
Enterprise News
Recruitment Information
Contact Us
Enterprise Profile
Shanghai DGT Co.,Ltd.
Founded in 2011, DGT Technology is a leading provider of essential test and measurement technologies along the full IC life cycle.
We specialize in the design, development and production of probe cards, test socket and testing equipment for the biggest technology brands in semiconductor industry.
We have 5 production sites, 1 R&D center and 3 sales offices capable of serving global customers. We strongly believe in the development of advanced technologies and possess more than 110 proprietary patents.
Our extensive product portfolio including Cantilever, Vertical and MEMS probe cards. We have rich chip probing experience in memory, CPU, GPU, DDl, CIS, WAT, Power device, resistor etc.
DGT possesses the capability and mature experience in providing global customers with probe card manufacturing, maintenance, and comprehensive testing solutions.
Development Process
2024
Complete the construction of new factories and invest in new product lines.
2023
Further enhance the production capacity of MEMS card successfully expand Dalian Intel, Hefei Changxin and other important customers.
2022
Completion of MEMS card production line construction, mass production and supply
2021
Investment in the construction of the first domestic MEMS card production line
2020
MEMS card through the Yangtze River storage project verification to become the only local probe card supplier
2019
Independent research and development of the first domestic MEMS probe card
2018
Research and Preliminary Preparation of MEMS for Successful Development of Vertical Card
2017
Completed the localization of China's CRRC IGBT test successfully developed DDI probe card
2014
Cantilever Card Mass Production
Honor
High-tech Enterprises
SMEs in Specialized New Sectors
Key "Little Giants" Enterprises
Shanghai Head Office: Room 104, Building 2, No. 207 Huanqiao Road, Pudong New Area, Shanghai
Shenzhen Branch： Building 1, Phase 3, Baoneng Science Park, No.1 Qingxiang Road, Longhua District, Shenzhen City, Guangdong Province, China
Contact Us： 0755-84861581
E-mail： info@dgtteco.com
