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D-VM

D-VM probe card for multi-sites-WLCSP, Flip Chip, SOC & Logic Device, etc. wafer mass production stage of high-efficiency (high-density, high number of DUTs) test, the number of pins 10000-30000. 

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  • Features
  • Parameters
  • D-VM Probe Card mainly uses MEMS process to produce probes with higher precision and smaller size. In the very narrow pitch wafer test, only a very small scratch marks, which effectively increase the durability and reduce the frequency of needle change to meet the smaller Pitch, accommodate more Pins, shorter needle length, to meet the higher frequency.

  • ● For more information, please contact us.

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