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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
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Testing SystemPower Testing System
WAT Testing System
IC Testing System
RF Testing System
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Enterprise News
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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
-
Testing SystemPower Testing System
WAT Testing System
IC Testing System
RF Testing System
-
Enterprise Profile
Enterprise News
Recruitment Information
Contact Us
D-VS
D-VS Probe Card is used for BGA, WLCSP, Flip Chip, SOC & Logic Device, MCU and other products testing.
Classification:
- Features
- Parameters
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● Various sizes of spring-loaded pins are available.
● High overload, current and frequency, low impedance, high current load up to 1~3A/pin.
● Stable contact, small scratches, meet multiple package types, meet WLCSP wafer level testing.
● Single pin easy to replace, good maintenance performance.
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● For more information, please contact us.
Shanghai Head Office: Room 104, Building 2, No. 207 Huanqiao Road, Pudong New Area, Shanghai
Shenzhen Branch： Building 1, Phase 3, Baoneng Science Park, No.1 Qingxiang Road, Longhua District, Shenzhen City, Guangdong Province, China
Contact Us： 0755-84861581
E-mail： info@dgtteco.com
