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D-VC

D-VC probe card adopts advanced bendable probe (Cobra), which is used in the mass production stage of WLCSP, Flip Chip, SOC & Logic Device, MCU and other wafers for high efficiency (high-density, high number of co-detection DUTs) testing.

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  • Features
  • Parameters
  • Single pin easy to replace, good maintenance performance.

    Meet the requirements of multi-PIN number, multi-DUT, Multi DUT, and multi-type package.

    Multiple probe sizes are available.

    Low contact pressure, small scratches, stable contact.

  • ● For more information, please contact us.

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