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Shenzhen Dougte Technology Co., Ltd.
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      • MEMS Probe Card

      • Vertical Probe Card

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      • D-VS Series

      • D-VW Series

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      • SOC / LOGIC IC Probe Card

      • DDI Probe Card

      • CIS Probe Card

      • Parametric Probe Card

      • Memory Devices Probe Card

      • Power Semiconductors Probe Card

      • Chip Resistor Probe Card

      • Pin Testing Machine

      • Probe Card Testing Machine

      • Probe Card Adjusting Machine

      • Probe Card Grinding Machine

      • Tool Microscope

      • Custom Fixture

      MEMS Probe Card
      MEMS Probe Card
      MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.
      Vertical Probe Card
      Vertical Probe Card
      Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.
      Cantilever Probe Card
      Cantilever Probe Card
      Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.
      Probe Card Test Equipment
      Probe Card Test Equipment
      The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
  • Testing System

      Testing System
      • Power Testing System

      • WAT Testing System

      • IC Testing System

      • RF Testing System

      Power Testing System
      Power Testing System
      WAT Testing System
      WAT Testing System
      IC Testing System
      IC Testing System
      RF Testing System
      RF Testing System
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      Contact Us
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Shenzhen Dougte Technology Co., Ltd.
  • Home Page

  • Products

      Products
      • MEMS Probe Card

      • Vertical Probe Card

      • Cantilever Probe Card

      • Probe Card Test Equipment

      • Flash Probe Card

      • DRAM Probe Card

      • D-VC Series

      • D-VS Series

      • D-VW Series

      • D-VM Series

      • SOC / LOGIC IC Probe Card

      • DDI Probe Card

      • CIS Probe Card

      • Parametric Probe Card

      • Memory Devices Probe Card

      • Power Semiconductors Probe Card

      • Chip Resistor Probe Card

      • Pin Testing Machine

      • Probe Card Testing Machine

      • Probe Card Adjusting Machine

      • Probe Card Grinding Machine

      • Tool Microscope

      • Custom Fixture

      MEMS Probe Card
      MEMS Probe Card
      MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.
      Vertical Probe Card
      Vertical Probe Card
      Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.
      Cantilever Probe Card
      Cantilever Probe Card
      Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.
      Probe Card Test Equipment
      Probe Card Test Equipment
      The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
  • Testing System

      Testing System
      • Power Testing System

      • WAT Testing System

      • IC Testing System

      • RF Testing System

      Power Testing System
      Power Testing System
      WAT Testing System
      WAT Testing System
      IC Testing System
      IC Testing System
      RF Testing System
      RF Testing System
  • About Us

      About Us
      • Enterprise Profile

      • Enterprise News

      • Recruitment Information

      • Contact Us

      Enterprise Profile
      Enterprise Profile
      Enterprise News
      Enterprise News
      Recruitment Information
      Recruitment Information
      Contact Us
      Contact Us
  • Get A Quote

Enterprise News

Enterprise News

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Exhibition activities

May 21,2024

Exhibition invitation | DGT will meet you at SEMICON Southeast Asia 2024


The 2024 Malaysia International Semiconductor Exhibition SEMICON Southeast Asia will be held in Kuala Lumpur, Malaysia on May 28-30, 2024. As a leading company in the field of Probe Card, DGT was invited to participate in this exhibition, booth number 924.

Exhibition invitation | DGT will meet you at SEMICON Southeast Asia 2024

Mar 18,2024

DGT | Semican is meeting you ...


From March 20th to March 22nd, 2024, SEMICON CHINA will be held at the Shanghai New International Expo Center.

DGT | Semican is meeting you ...

Nov 01,2023

Invitation | DGT meets you at ICCAD Guangzhou 2023


We sincerely invite you to attend the “29th China IC Design Industry 2023 Annual Conference & Guangzhou IC Industry Innovation and Development Summit Forum (ICCAD)” which will be held on November 10-11, 2023 at Guangzhou Poly World Trade Center. We warmly welcome friends and partners in the industry to visit us at booth J12 and look forward to seeing you there!

Invitation | DGT meets you at ICCAD Guangzhou 2023

Jun 26,2023

DGT to Present Full Series of Three Generation Probe Cards with MEMS Card, Vertical Card and Cantilever Card at SEMICON CHINA 2023


June 29, 2023 - July 1, 2023 SEMICON CHINA 2023 Shanghai International Semiconductor Exhibition will be held in Shanghai New International Expo Center. Ltd. will bring MEMS card, vertical card, cantilever card full series of three generations of probe card products at the exhibition (DGT booth number: E1 Hall 711), and look forward to your visit to communicate!

DGT to Present Full Series of Three Generation Probe Cards with MEMS Card, Vertical Card and Cantilever Card at SEMICON CHINA 2023
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 深圳市道格特科技有限公司

Shanghai Head Office: Room 104, Building 2, No. 207 Huanqiao Road, Pudong New Area, Shanghai

Shenzhen Branch: Building 1, Phase 3, Baoneng Science Park, No.1 Qingxiang Road, Longhua District, Shenzhen City, Guangdong Province, China

Contact Us: 0755-84861581

E-mail: info@dgtteco.com

  • Products

    • MEMS Probe Card

    • Vertical Probe Card

    • Cantilever Probe Card

    • Probe Card Test Equipment

  • Testing Syetem

    • Power Testing System

    • WAT Testing System

    • IC Testing System

    • RF Testing System

  • About Us

    • Enterprise Profile

    • Development Process

    • News

    • Exhibition Activities

  • Recruitment Information

    • Recruitment Announcement

  • Contact Us

    • Contact Information


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