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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
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Testing SystemPower Testing System
WAT Testing System
IC Testing System
RF Testing System
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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
-
Testing SystemPower Testing System
WAT Testing System
IC Testing System
RF Testing System
-
Enterprise Profile
Enterprise News
Recruitment Information
Contact Us
DGT to Present Full Series of Three Generation Probe Cards with MEMS Card, Vertical Card and Cantilever Card at SEMICON CHINA 2023
Release time:
2023-06-26 11:41
Source:
June 29, 2023 - July 1, 2023 SEMICON CHINA 2023 Shanghai International Semiconductor Exhibition will be held in Shanghai New International Expo Center. Ltd. will bring MEMS card, vertical card, cantilever card full series of three generations of probe card products at the exhibition (DGT booth number: E1 Hall 711), and look forward to your visit to communicate!
Photo Exhibition Address: Shanghai New International Expo Center (2345 Longyang Road, Pudong New Area, Shanghai)
About DGT
Founded in 2011, DGT specializes in the development, manufacturing and sales of Probe Cards for semiconductor wafer testing and semiconductor testing services. The company is headquartered in Shenzhen and has subsidiaries in Wuhan, Qidong, Shanghai and Suzhou.
Our main projects include: wafer test probe card (Cantilever Probe Card, Vertical Probe Card, MEMS Probe Card) design and production, IC test board (Loadboard) design and production, high-end IC test socket, high-frequency cable design and production, semiconductor test equipment. Equipment.
With the independent R&D capability of probe card and a full set of key equipments for probe card manufacturing, Dgtteco is committed to providing customers with precision test system solutions.
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Shanghai Head Office: Room 104, Building 2, No. 207 Huanqiao Road, Pudong New Area, Shanghai
Shenzhen Branch： Building 1, Phase 3, Baoneng Science Park, No.1 Qingxiang Road, Longhua District, Shenzhen City, Guangdong Province, China
Contact Us： 0755-84861581
E-mail： info@dgtteco.com
