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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
-
Testing SystemPower Testing System
WAT Testing System
IC Testing System
RF Testing System
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Enterprise Profile
Enterprise News
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DGT was honored as one of the “2023 Shenzhen Top 100 Industry Leaders”.
Release time:
2023-09-21 11:37
Source:
On September 21st, 2023, the results of “Top 100 Shenzhen Industry Leaders in 2023” and “Top 50 Shenzhen Future Industry Leaders in 2023” jointly organized by Shenzhen Industry Leaders Enterprise Development Promotion Association and Shenzhen Business News/Yangchuang were released. Ltd., as a leading enterprise in the probe card industry, was successfully selected as one of the “2023 Shenzhen Top 100 Industry Leaders”.
Throughout the two lists, 90% of the Top 100 Shenzhen Industry Leaders and 100% of the Top 50 Future Industry Leaders have the characteristics of intelligence, greening, integration or advancement, which will help Shenzhen build a modernized industrial system with Shenzhen characteristics, accelerate the formation of new quality productivity, and accelerate the construction of a globally important and influential industrial science and technology innovation center.
Shanghai Head Office: Room 104, Building 2, No. 207 Huanqiao Road, Pudong New Area, Shanghai
Shenzhen Branch： Building 1, Phase 3, Baoneng Science Park, No.1 Qingxiang Road, Longhua District, Shenzhen City, Guangdong Province, China
Contact Us： 0755-84861581
E-mail： info@dgtteco.com
