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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
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MEMS Probe Card
MEMS is the abbreviation of Micro Electro Mechanical Systems. The MEMS probe card produced by our company has the advantages of improving electrical characteristics, and is also the best solution for testing storage devices that need to test a large number of wafer chip.Vertical Probe Card
Vertical probe card, usually with dense testing points, is suitable for wafer testing of logic type products. This includes products such as CPUs, GPUs, or MCUs, MPUs, as well as SoC products or WlCSP products tested on multiple sites. Its main characteristics are short probes, good consistency in impedance and other electrical properties, stable contact pressure, and relatively small needle marks, making it suitable for testing small spacing and high-frequency chips.Cantilever Probe Card
Cantilevered probe cards are often composed of PCBs, probes, epoxy rings, and functional components. Depending on the situation, there may also be electronic components, Stiffeners, and other components. By manually placing dozens to thousands of probes on the probe card according to the position of the solder pad of the chip to be tested.Probe Card Test Equipment
The device is primarily applied in the semiconductor industry for testing probes used in probe cards and for inspections during the design phase of probe cards. This includes contact resistance testing, high and low needle pressure testing, needle life testing, CCC (Contact Check and Calibration) testing, and more.
-
Testing SystemPower Testing System
WAT Testing System
IC Testing System
RF Testing System
-
Enterprise Profile
Enterprise News
Recruitment Information
Contact Us
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Probe card
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<p style="text-indent:21.0000pt; text-align:justify"><span style="font-size:10.5pt"><span style="text-autospace:ideograph-numeric"><span style="font-family:Calibri"><i><span style="font-size:10.5000pt"><span style="font-family:'Segoe UI'"><span style="font-style:italic">Probe cards are devices that connect semiconductor chips and test equipment to check chip functionality.</span></span></span></i></span></span></span></p> <p style="text-indent:21.0000pt; text-align:justify"><span style="font-size:10.5pt"><span style="text-autospace:ideograph-numeric"><span style="font-family:Calibri"><i><span style="font-size:10.5000pt"><span style="font-family:'Segoe UI'"><span style="font-style:italic">Flash memory is a memory that does not lose data even when power is cut off, and unlike general semiconductor memory (DRAM), the contents can be corrected by applying a slightly higher voltage.</span></span></span></i><i> </i><i><span style="font-size:10.5000pt"><span style="font-family:'Segoe UI'"><span style="font-style:italic">Compared with DRAM, the output of each product is larger, and the probe card is in large demand, but the number of pins required is smaller.</span></span></span></i><i> </i><i><span style="font-size:10.5000pt"><span style="font-family:'Segoe UI'"><span style="font-style:italic">Flash is divided into two types of data storage with large capacity storage (NAND Flash) and code storage with fast processing speed (NOR Flash).</span></span></span></i></span></span></span></p>
隐藏域元素占位
<p style="text-indent:21.0000pt; text-align:justify"><span style="font-size:10.5pt"><span style="text-autospace:ideograph-numeric"><span style="font-family:Calibri"><i><span style="font-size:10.5000pt"><span style="background:#fdfdfd"><span style="font-family:'Segoe UI'"><span style="color:#000000"><span style="letter-spacing:0.0000pt"><span style="font-style:italic">Probe</span></span></span></span></span></span></i><i> </i><i><span style="font-size:10.5000pt"><span style="background:#fdfdfd"><span style="font-family:'Segoe UI'"><span style="color:#000000"><span style="letter-spacing:0.0000pt"><span style="font-style:italic">cards are devices that connect semiconductor chips and test equipment to check chip functionality.</span></span></span></span></span></span></i></span></span></span></p> <p style="text-indent:21.0000pt; text-align:justify"><span style="font-size:10.5pt"><span style="text-autospace:ideograph-numeric"><span style="font-family:Calibri"><i><span style="font-size:10.5000pt"><span style="background:#fdfdfd"><span style="font-family:'Segoe UI'"><span style="color:#000000"><span style="letter-spacing:0.0000pt"><span style="font-style:italic">DRAM probe card</span></span></span></span></span></span></i><i> </i><i><span style="font-size:10.5000pt"><span style="background:#fdfdfd"><span style="font-family:'Segoe UI'"><span style="color:#000000"><span style="letter-spacing:0.0000pt"><span style="font-style:italic">require</span></span></span></span></span></span></i><i><span style="font-size:10.5000pt"><span style="background:#fdfdfd"><span style="font-family:'Segoe UI'"><span style="color:#000000"><span style="letter-spacing:0.0000pt"><span style="font-style:italic">s</span></span></span></span></span></span></i><i><span style="font-size:10.5000pt"><span style="background:#fdfdfd"><span style="font-family:'Segoe UI'"><span style="color:#000000"><span style="letter-spacing:0.0000pt"><span style="font-style:italic"> higher speed and precise timing than N</span></span></span></span></span></span></i><i><span style="font-size:10.5000pt"><span style="background:#fdfdfd"><span style="font-family:'Segoe UI'"><span style="color:#000000"><span style="letter-spacing:0.0000pt"><span style="font-style:italic">AND</span></span></span></span></span></span></i><i><span style="font-size:10.5000pt"><span style="background:#fdfdfd"><span style="font-family:'Segoe UI'"><span style="color:#000000"><span style="letter-spacing:0.0000pt"><span style="font-style:italic"> probe card, so technology difficulties such as fine-pitch Probe Card Pins and Pitch in Cooperative Probing are high.</span></span></span></span></span></span></i></span></span></span></p>
隐藏域元素占位
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